Beyond CMOS: From Devices to Systems

  • Date/Time
    Date(s) - 05/06/2017 - 06/06/2017
    All Day

    Kogan Auditorium, Meyer Building (EE)

    Categories No Categories


    Beyond CMOSResearch Workshop of the Israel Science Foundation (ISF)

    2017 Stephen and Sharon Seiden Frontiers in Engineering and Science Workshop:

    Beyond CMOS: From Devices to Systems

    Related-Events-icon  Poster-icon Registration Program-icon

    Technion, Haifa, Israel on 5-6 June 2017


    Registration is now open! 

    Beyond CMOS: From Devices to Systems. Emerging solid state memories will extend CMOS technology. Including Device Physics, Circuits, Architecture, Reliability, Security, and Systems.
    These technologies include RRAM, PCM, 3D Xpoint, STT MRAM, CBRAM, Memristors, and others.

    This workshop will bring together researchers and executives from academia and industry to discuss the different implications of emerging solid state memories on computer industry.

    Conference Chairs:

    Eby G. Friedman, ECE University of Rochester

    Avinoam Kolodny, EE Technion

    Shahar Kvatinsky, EE Technion

    Confirmed speakers include:

    Alyssa Apsel Cornell, USA
    Alon Ascoli Technische Universität Dresden, Germany
    Leon Chua University of California, Berkeley, USA
    Ramez Danial Technion, Israel
    Massimiliano Di Ventra
    University of California, San Diego, USA
    Eby Friedman University of Rochester, USA
    Joseph S. Friedman
    University of Texas at Dallas, USA
    Pierre-Emmanuel Gaillardon
    University of Utah, Salt Lake City, USA
    Giacomo Indiveri
    University of Zurich | ETH Zurich, Switzerland
    Engin Ipek University of Rochester, USA
    Edwin Chihchuan Kan Cornell, USA
    Michael Kozicki Arizona State University, USA
    Hai Li Duke University, USA
    Michal Lipson Columbia University, USA
    Giovanni De Micheli EPFL, Switzerland
    Thomas Mikolajick TU Dresden | Namlab, Germany
    Onur Mutlu Carnegie Mellon University | ETH Zurich, Switzerland
    Stuart Parkin Max Planck Institute, Germany
    Damien Queriloz Paris-Sud University, France
    Jennifer Rupp MIT, USA
    Sabina Spiga National Research Council, Italy
    Mircea R. Stan University of Virginia, USA
    Ronald Tetzlaff Technische Universität Dresden, Germany
    Ioannis Vourkas Pontifical Catholic University of Chile, Chile
    Uri Weiser Technion, Israel
    Yuan Xie University of California at Santa Barbara, USA
    Eli  Yablonovitch University of California, Berkeley, USA
    Jianhua Joshua Yang University of Massachusetts, USA

    Amit Berman, Samsung
    Boaz Eitan, Q-Core Medical
    Avi Klein, Western Digital
    Suhas Kumar, HPE
    Pankaj Mehra, Western Digital
    Pei-Lin Pai, Winbond Technologies
    Amir Regev, Weebit-Nano
    Yakov Roizin, Tower Jazz
    Abu Sebastian, IBM


    About the Conference 


    Advancements in computer capabilities in the last fifty years had been closely linked to miniaturization of CMOS technology, while the underlying structure of digital computing systems has been based on von Neumann architecture, where the memory and execution units are logically and physically separated, using various types of interconnect for communication between them. Recently, device scaling has slowed down, while electrical interconnect has become both a performance bottleneck and a major source of power dissipation, which is currently the most critical limiter for technology growth. Conventional memory technologies, such as Flash, DRAM, and SRAM, are unable to keep up with market requirements for higher density and lower power. Flash memory has already achieved its physical limits, and cannot be scaled further, primarily due to its limited endurance.

    These problems can be addressed by emerging new semiconductor devices, such as Resistive Random Access Memory (RRAM), Conductive Bridge Random Access Memory (CBRAM), Phase Change Memory (PCM), Spin-Transfer Torque Magentoresistance Random Access Memory (STT-MRAM), memristors, 3D Xpoint and others. Since these technologies are useful both as memory cells and as novel switching circuits, they can be used to augment traditional CMOS gates and enable new computing systems.

    This workshop will bring together researchers and executives from academia and industry to discuss the different aspects of emerging solid state memories including device physics, circuits, architecture, reliability, security, software, and system. We believe that these technologies open opportunities for radical changes in all of the aforementioned aspects and that bringing together people from different disciplines can give better perspective on the influence of these technologies and be mutually inspiring.

    We will have speakers from all of these fields, including world-leading researchers and executives from industry who will discuss the commercialization aspects of these technologies. The speaker list covers speakers from all of the disciplnes and together they will cover all of the relevant issues that need to be considered when adding new technologies to existing systems and how these technlogies may enable new systems.

    We expect a large national and international audience to attend the workshop, including students who will present posters. The workshop is part of the "Stephen and Sharon Seiden Frontiers in Engineering and Science Workshop" annual event at the Technion and will be followed by the annual training school of EU COST Action IC-1401 MemoCIS




    Important dates:

    Poster submission (Extended!) 15th April 2017
    *(Please submit a title, a list of authors including affiliations and an abstract – up to 1 page, here)
    Early bird registration                 15th April 2017
    Poster acceptance notification    1st May 2017
    Registration                               1st May 2017

    location information:

    for help and more information please visit the folowing pages: 

    • Visiting Israel: here
    • Getting around: here 

    • Accomodation: here

    • Other recommendations: here

    For any questions or further assistance don't hesitate to contact Shahar, local chair ​or Liraz, local administration.

    Proudly sponsored by:

    acrc annotated logo COST icri-ci(2)_2colors_blue IEEE ISF MOST_HEB1 Haifa Muni seeei_logo